Products

34-layer high-rise board

▪ Number of layers – 34L


▪ Material - S1000-2

▪ Plate thickness —— 4.6mm

▪ Aspect ratio – 18:1

▪ Blind holes – L32 – L34

▪ Inner layer copper thickness – 1 & 2 oz

▪ Minimum line width/line spacing - 0.1mm

▪ Minimum hole diameter - 0.25/0.4mm

▪ Impedance - more than 20 impedance lines

▪ Surface treatment - immersion gold

34层高层板(图1)


20-layer high-rise board

▪ Number of layers - 20L

▪ Material - IT180ATC

▪ Plate thickness —— 2.35±0.1mm

▪Copper thickness of inner and outer layers——0.5OZ

▪ Minimum line width/line spacing - 0.072/0.255mm

▪ Minimum hole diameter - 0.131mm

▪ Surface treatment - immersed gold + gold finger

▪ Application areas - communication equipment

20层高层板(图1)


Level 2 HDI high-rise board

▪ Number of layers – 22L

▪ Material - FR-4(Tg180) VT-47

▪ Plate thickness —— 2.59+/-0.26mm

▪ Minimum line width/space - 3.5/5.0mil

▪ Minimum hole diameter - 0.25mm

▪ Surface treatment - immersion gold

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