Products

High frequency antenna board

▪ Number of layers – 2L

▪ Material - Doosan DS-7409DV high frequency material

▪ Plate thickness——0.76mm±0.07mm

▪ Minimum line width/line spacing - 0.580mm±5%

▪ Minimum hole diameter - 0.2mm

▪ Surface treatment - immersed tin


高频天线板(图1)



5G communication high-speed products

▪ 22L

▪ High speed and low consumption

▪ 2 times of lamination (3-22 layers for the first time, 1-22 layers for the second time)

▪ 11 back drill belts, VIPPO

▪ Embedded with 22 copper blocks

▪ 10 different impedances (single-ended/differential)

▪ High voltage and low voltage electroplating hole filling process


5G通讯高速产品(图1)


5G high frequency board

▪ Number of layers – 8L

▪ Material – MT77

▪ Plate thickness——1.43mm

▪ Copper thickness of inner and outer layers——1oz

▪ Minimum line width/line spacing - 0.25/0.25mm

▪ Minimum hole diameter - 0.3mm

▪ Surface treatment - immersion gold

▪ Others - 0.127mm back drilling


5G高频板(图1)


high speed board

▪ Number of layers – 26L

▪ Material – Tachyon 100G, hydrocarbon

▪ Plate thickness —— 3.5±0.35mm

▪ Copper thickness of inner and outer layers —— 0.33OZ

▪ Minimum line width/line spacing - 0.118/0.051mm

▪ Minimum hole diameter - 0.225mm

▪ Surface treatment - immersion gold

▪ Application areas - industrial control systems


高速板(图1)



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